1.No bubble rapid film sticker;
2.The film machine table do antistatic Teflon treatment can protect the chip, convenient replacement of the panel;
3. The roller system adjusts its height according to the different thickness of the product in order to prevent the product from breaking.
4.Equipment marking system;
5.The equipment involves different fields, and can be designed according to the products of different fields.
Apply toIC、Diode、Transistor、Glass、LED、QFN、PCBIn the same industry, this product is suitable for the cutting process before cutting in the semiconductor wafer cutting process.