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Grouped equipment

Wafer Mounter

Main features:

1.No bubble rapid film sticker;

2.The film machine table do antistatic Teflon treatment can protect the chip, convenient replacement of the panel;

3. The roller system adjusts its height according to the different thickness of the product in order to prevent the product from breaking.

4.Equipment marking system;

5.The equipment involves different fields, and can be designed according to the products of different fields.


Application:

Apply toIC、Diode、Transistor、Glass、LED、QFN、PCBIn the same industry, this product is suitable for the cutting process before cutting in the semiconductor wafer cutting process.

Detail:

model

TM806

TM808

working size

3-6 inch

3-8 inch

Thickness range

150-800 μm

Tape

Blue tape、UV tape

Thickness range 0.05-0.2mm

Width ≤300mm

heating temperature

Normal atmospheric temperature~80

Dimensions

740x385x290 mm

820x410x350 mm

weight

50Kg

55Kg



+86-024-81866018
No. 19 Hunnan East Road, Hunnan New District, Shenyang, Liaoning Province, China
CONTACT US
+86-024-81866018
No. 19 Hunnan East Road, Hunnan New District, Shenyang, Liaoning Province, China
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