Main features:
1.No bubble rapid film sticker;
2.The film machine table do antistatic Teflon treatment can protect the chip, convenient replacement of the panel;
3. The roller system adjusts its height according to the different thickness of the product in order to prevent the product from breaking.
4.Equipment marking system;
5.The equipment involves different fields, and can be designed according to the products of different fields.
Application:
Apply toIC、Diode、Transistor、Glass、LED、QFN、PCBIn the same industry, this product is suitable for the cutting process before cutting in the semiconductor wafer cutting process.
Detail:
model | TM806 | TM808 |
working size | 3-6 inch | 3-8 inch |
Thickness range | 150-800 μm | |
Tape | Blue tape、UV tape | |
Thickness range 0.05-0.2mm | ||
Width ≤300mm | ||
heating temperature | Normal atmospheric temperature~80℃ | |
Dimensions | 740x385x290 mm | 820x410x350 mm |
weight | 50Kg | 55Kg |
