Wafer Cleaning

Main features:

1.A variety of cleaning mode, optional two fluid cleaning, nitrogen cleaning, ultra high pressure cleaning and other modes;

2.Suitable for blue tape、UV tape、PET substrate and double layer tape

3.PLC full automatic control, touch control operation, parameter and cleaning mode intelligent editing, simple and convenient operation.

4. Adopt aviation industry sealing technology, safe and reliable

5. Adopt centrifugal automatic grasping and locking device

6. Equipped with 7-inch color touch screen, cleaning parameters and alarm information are clear

Application：

mainly used in the industry of material preparation, solar cell chip, discrete device and so on Eight The cutting and drying process of the wafer or device after the cutting.

Detail：